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2KG038075NGL
SWITCHING DIODE CHIPS

2KG038075NGL is a common cathode double core switching diode chips fabricated in silicon epitaxial planar technology.

The parameters of diode match well due to double dice on the same chip substrate.

Optimized graph design suit for encapsulation bonding, and the interference is very small between two dice.

The wafer thickness is 540 mm. The top electrodes material is Al, and there is no back-side electrodes material.

Die size: 0.38 X 0.38 (mm2)