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In December 2019, the roof-topping ceremony of the building of Silan’s production line for 12-inch chips with special process and the commissioning ceremony of the production line for advanced compound semiconductor chips were held in Xiamen.
On April 11, 2018, Silan’s project “high-speed low-power multi-chip module with a high voltage of more than 600V” won “The First Prize of Zhejiang Progress Award in Science and Technology”.
In December 2017, a strategic cooperation framework agreement with a total investment of 22 billion RMB was signed by Silan and Haicang District Government, Xiamen, planning to build two production lines for 12-inch wafer with special process and a production line for advanced compound semiconductor device;
In October 2017, Silan's six-axis inertial sensor SC7I20 won “The 12th "China Chip" Most Potential Product Award in 2017”.